Smart Silicon-on-Insulator Sensing Systems Operating at High Temperature

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SOI-HITS Project

This project has received funding from the European Union’s Seventh Framework Programme for research, technological development and demonstration under grant agreement no 288481.

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Université Catholique de Louvain

Two UCL labs are involved in this project - EMIC and DICE.

EMIC (Microwave) is a group of about 40 researchers, all working in the microwave and millimetre wave range, with a strong experimental and technological background. Four themes are currently investigated: RF electronics, including active and passive integrated circuits, communications, MEMS sensors and actuators including the extraction of intrinsic thermo-(electro)mechanical properties of materials at nanometre scale, and bioelectromagnetics.

DICE (Microelectronics) is a laboratory of about 70 researchers, active in semiconductor devices and integrated circuits, from technology to system level applications. Silicon-on- Insulator (SOI) has been a major theme of R&D for more than 20 years, leading to significant contributions with regards to e.g. double-gate MOSFETs, nanowires, high-temperature SOI CMOS, Ultra-Low-Power smart sensors (including biosensors) in terms of processing, characterisation, simulation, modelling and design. The ELEC department runs two major UCL infrastructures. WINFAB, Wallonia Nano Fabrication Infrastructure, 1000 m2 of clean rooms with a full pilot line for SOI CMOS processing, nanoelectronics, organic electronics, integrated sensors/MEMS/NEMS and photovoltaics. WELCOME, Wallonia Electronics and Communications Measurements, for the characterisation of electronics devices, planar hybrid, and integrated circuits, from DC up to 110 GHz (including on-wafer measurement) and in a wide temperature range from 3K to 300°C. The infrastructure is also equipped for the topography and vibration analysis of MEMS and a climatic chamber for humidity varying conditions from 10% RH to 100% RH between -50°C and 140°C.

Tasks in the project

UCL are responsible for the design of the humidity and UV sensors within WP2 and WP3, as well as in WP4, the innovative investigation of analogue sensor-to-frequency conversion interfaces and hightemperature sensor interfaces. In WP1, they will also provide their own data regarding SOI temperature, optical, gas and humidity sensors. UCL will contribute in WP5, in addition to circuits and sensors, designing and testing specific test microstructures used to characterize the intrinsic mechanical and electrical properties of thin films (ductile and fragile), fabricated near the sensors

Experience relevant to the task

With regards to gas and humidity sensors, the two UCL teams have been collaborating for a number of years on micro-hot-plate realization in SOI and on Al203 layers. With regards to testing micro-machines, this is a very original expertise of the EMIC lab covering fundamental properties of very thin film mechanics as well as industrial transfer through services and patents. With regards to SOI CMOS circuit design for high temperature applications, including UV and temperature sensors, DICE has been active since 1993 and is a recognized world expert with numerous contributions in international conferences and journals. Several high-temperature and low-power original design techniques have been experimented and patented.

 Curriculum Vitae of key staff

 Prof. D. Flandre is a specialist in SOI technology, devices and circuits for more than 20 years. He has published over 450 papers and 8 patents in the field. He is an IEEE Senior member. He has participated in numerous EU research projects since FP4. He coordinated the FP5 project ATHIS (Advanced Techniques for High-Temperature System-on-Chip).

Prof. J.-P. Raskin is head of Microwave Laboratory of UCL. His research interests are the modelling, wideband characterisation and fabrication of advanced SOI MOSFETs as well as micro and nanofabrication of MEMS / NEMS sensors and actuators, author or co-author of more than 150 journal papers, 300 contributions at international conferences and 6 patents.

Prof. L. Francis‿span class="C-3"> background is in MEMS/NEMS sensors and actuators, acoustic biosensors, thin films integration, piezoelectric materials, and MEMS packaging. He is an IEEE member and currently holds the Microsystems Chair at UCL since 2007. Previously, he was researcher at IMEC in the biosensors and RFMEMS groups.

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Prof. D. Flandre
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