!DOCTYPE html> Microsemi

Smart Silicon-on-Insulator Sensing Systems Operating at High Temperature

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SOI-HITS Project

This project has received funding from the European Union’s Seventh Framework Programme for research, technological development and demonstration under grant agreement no 288481.

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Microsemi Corporation a multi-national semiconductor company headquartered in Canada.

At the facility in Caldicot (Wales) UK, the team design develop and manufacture advanced microelectronic technologies, (miniaturisation, low power wireless communication, energy harvesting and high ambient temperature electronics). The site also has extensive micro-packaging capabilities for medical wireless, telecommunications and security related customers.

Tasks in the project

Microsemi will undertake the general management and administrative aspects of the project including providing the Project Coordinator and general exploitation expertise. Due to the specialist nature of the project Scientific Coordination will be provided by UCAM. Microsemi will lead the package design, material selection and develop demonstrators within WP6.

Experience relevant to the tasks

Microsemi first joined the FP6/7 funded projects and latterly managed the Healthy Aims IP in 2003. Since then Microsemi has been involved with 6 EU projects and managed 2. Microsemi has also managed and contributed to UK funded projects via the TSB, and NHS. For the past 3 years Microsemi has been developing and qualifying high temperature assembly/packaging capabilities targeting 225oC ambient operating temperature.

Team Members

Martin McHugh Graduated in 1982 in Electronics and Electrical Engineering, he spent the early part of his career designing portable computer field diagnostic equipment, moving on to become Sales Manager for the UK’s largest contract electronic manufacturing company. He gained and MA in 1995 before moving to Keltek as Group Business Development Manager in 1996. He joined Microsemi Semiconductor in early 1999 heading up Business and Technology Development focussing on technology exploitation. He gained an MBA in 2002, specialising in managing innovation within Multinational Corporations. He currently sits on the industrial Advisory board for the School of Engineering at Cardiff University and is studying for his PhD on the effect of FDI in Wales.

Trace Wotherspoon Graduated from Birmingham City University in 1984 with a HND in Electrical and Electronic Engineering. Following graduation he spent the first two years of his career as a sales and applications engineer in the process control industry before transferring to the design of broadcast quality sound mixers with Audio Developments (Walsall) and latterly Coomber Electronic Equipment (Worcester). Following Microsemi’s move into medical electronic assembly he was awarded an MSc in Clinical Engineering. From Cardiff University specialising in medical RF. He began working on FP research projects in 2002 and was appointed Work Package leader in the Health Aims IP in 2007. He has subsequently managed several research projects including the IET Innovation Award winning national UK project. He has patents pending in the field of energy harvesting and low power communication as well as several publications and a pending book chapter.

Piers Tremlett has over 20 years experience working in the development of new packaging processes and designs within Microsemi's Advanced Packaging Business previously with Lucas Automotive, sensors and controls.

He holds a BSc and an MSc in Micro-electronics and is a regular presenter at international conferences on micro-electronics and packaging.

He is Microsemi’s senior specialist on the subject of microelectronics supporting the strategy around the next generation of miniaturisation.

His experience includes spearheading Microsemi’s embedded die developments for System In a Package, a leading technical contributor on the TIPS EU FP7 project program, developing ultra thin package stacks. Most recently and relevantly headed up collaboration on developing high temperature packaging for furnace applications.

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Martin McHugh Trace Wotherspoon Piers Tremlett
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